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E-Mobility epoxy resins

Resin for Electrical Insulation

Protect your component with the right resin.

S.E. SPECIAL ENGINES develops and produces high-performance PU and Epoxy resin for the electrical and electronic industry. These systems are designed for high and low voltage applications.

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Category

Epoxy

  • wide range of hardness from shoreD 20 to shoreD 85;
  • wide range of Glass Transition;
  • wide range of viscosity;
  • high wetting and penetration between wires and cables;
  • high humidity and water resistance.
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Heat Curing Epoxy

S.E. (SPECIAL ENGINES) develops and produces high-performance Epoxy resins for the high-voltage applications, where the maximum impregnation of the windings is necessary.

We can support you with our knowledge to select the best process in order to enhance the dielectric properties of the units.

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  • wide range of Glass Transition: from -40°C to +160 °C;
  • high wetting and penetration between wires and cables;;
  • high humidity and water resistance;
  • high thermal shock resistant;
  • no sedimentation.
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Polyurethane

  • wide range of hardness from shoreD20 to shoreD 85;
  • low viscosity product for high penetration for easy workable;
  • no sedimentation;
  • special product for bif parts: no shrinkahge, no exothermicity;
  • self exstinguishing UL94 V0/V1;
  • high thermal shock resistance.
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Some of our resins

 
EPOXY RESIN SYSTEMS
RESIN + HARDENER Mix Ratio (by weight) Mixed Viscosity @ 25°C Glass Transition Tg °C Thermal Conductivity [W/m°k] Description
Sepox 216 +
DK 601		 100÷30 800 13 0.4 Ideal for small devices (above all relays). Its low viscosity allows easy filling of narrow parts. High thermal shock resistant.
Sepox 225 +
DK 505		 100÷50 700 40 0.2 Transparent. Low viscosity.
UL Sepox 213 FR +
DK 503		 100÷13 1500 65 0.9 Flame resistant: UL 94 V0 4mm FILE E358582. Low viscosity with a special combination of fillers that assures no sedimentation even at high T°. Recommended for non-stop productions.
Sepox 215 FR +
DK 507		 100÷13 2000 100 0.9 Flame resistant. High mechanical properties and low shrinkage in polymerization. Excellent anti-settling properties. No abrasion.
Sepox 206 +
DK 602		 100÷50 (100÷100) 80000 (60000) nc 0.33-0.66 Adjustable final hardness according to mixing ratio. In compliance with MIL T 27-C (for Transormers and Inductors). High mechanical properties.
Sepox 214 FR +
DK 506		 100÷08 2000 70 0.6 Flame Retardant, mineral filled version of the Sepox 214.
Sepox 213 FR LV +
DK 503		 100÷13 1000 80 0.8 Flame resistant: UL 94 V0 4mm FILE E358582. Similar to Sepox 213 FR but suggested when lower hardness is needed.
Sepox 230 +
DK 503 L		 100÷15 10000 63 0.8 Excellent mechanical properties. Low shrinkage and low exothermicity in polymerization.
HEAT CURING EPOXY RESIN SYSTEMS
RESIN + HARDENER Mix Ratio (by weight) Mixed Viscosity @ 70°C Glass Transition Tg °C Operating Temperature [°C] Description
SEPOX 233 FR XP +
DK 401		 100÷18 400-500 85-95 -55°/ +180°

Specially designed for encapsulation of HEV motors stators.
Superior heat transfer which gives the motor a lowering of temperature during operation.

  • HIGH THERMAL SHOCKS RESISTANT to multiple thermal cycles
  • LOW VISCOSITY that guarantee superior impregnation properties for an highly filled material
  • LOW VOLUME SHRINKAGE after polymerization
  • THERMAL CONDUCTIVITY = 1.15-1.2 [W/M°K]
SEPOX 233 FR XP +
DK 442 XP		 100÷26 250-400 40-45 -55°/ +180°

Specially designed for encapsulation of HEV motors stators.
Good heat transfer which gives the motor a lowering of temperature during operation.
HOT CURING EPOXY RESIN FOR E-MOBILITY.

  • HIGH THERMAL SHOCKS RESISTANT to multiple thermal cycles
  • LOW VISCOSITY that guarantee superior impregnation properties for an highly filled material
  • LOW VOLUME SHRINKAGE after polymerization
  • THERMAL CONDUCTIVITY = 1.0-1.12 [W/M°K]
SEPOX 201 XP +
DK 433 XP		 100÷75 700-900 120–125 -55°/ +180°

HOT CURING EPOXY RESIN SPECIALLY FORMULATED FOR CAPACITORS.

  • HIGH THERMAL SHOCKS RESISTANT to multiple thermal cycles
  • LOW VISCOSITY that guarantee superior impregnation properties for an highly filled material
  • LOW VOLUME SHRINKAGE after polymerization
  • THERMAL CONDUCTIVITY = 0.85-0.95 [W/M°K]
Sepox 233 FR +
DK 441		 100÷35 500 -15 -55°/ +180° High elasticity, excellent thermal shock resistance. Thermal class H
Sepox 235 +
DK 401		 100÷35 150 85 -55°/ +180° High Thermal Conductivity, very high dielectric properties, good wetting on wires. Suggested for Vacuum Dispensing. Thermal class H
Sepox 234 FR TG +
DK 434		 100÷100 800 100 -55°/ +180° Flame Resistant: UL 94 V0 Thermal Class H. High thermal conductivity. Very low shrinkage.
Sepox 237 +
DK 401		 100÷32 200 115 -55°/ +180° High Thermal Conductivity, very high dielectric properties, good wetting on wires. Suggested for Vacuum Dispensing. Thermal class H
Sepox 241 FR +
DK 401 F		 100÷35 150 102 -55°/ +180° Flame Resistant: UL 94 V0 Thermal Class H. High thermal conductivity.
Sepox 239 +
DK 403		 100÷36 150 140 -55°/ +180° High Tg. Special product for pencil coils.
PU RESIN SYSTEMS
RESIN + HARDENER Mix Ratio (by weight) Mixed Viscosity @ 25°C Glass Transition Tg °C Operating Temperature [°C] Description
Sepur 116 FR +
DK 001		 100÷16 1400 -15 -40°/ +130° PU filled suitable when Self-extinguishing properties are required. Soft and elastic (Tg<15°C). Adapt for a wide range of applications. Very good thermal conductivity.
Sepur BD 020 FR +
DK 001		 100÷13 4000 <-40 -50°/ +130° Polybutadiene based Pu filled for application requiring Flame self-extinguishing and high thermal conductivity features. Low temperature resistance. High Waterproof resistance (wet environments or immersion applications). Special for High Power Inverter - Power and Control Electronics.
Sepur 125 FR +
DK 001		 100÷25 2500 50 -40°/ +130° General use System. Good mechanical resistance, low shrinkage in polymerization. Flame self-extinguishing. Special for: Capacitors featuring metalized plastic film.
Sepur 121 FR +
DK 001		 100÷40 750 105 -40°/ +155° Usually fo transformers and capacitors requiring Flame self-extinguishing feature at low thickness. Low viscosity. Low shrinkage in curing. High Tg.
Sepur 119 FR +
DK 001		 100÷18 1400 <-50 -50°/ +130° Special product for sensors. Filled PU with very low Glass Transition, adapt for low temperature applications. No change in mechanical properties during thermal ageing (@130°)
Sepur 116 +
DK 001		 100÷20 1800 3 -40°/ +130° Cost effective competitive PU filled. Good thermal conductivity. Low viscosity. General purpose.
Sepur BD 001 +
DK 015		 100÷34 1500 <-50 -50°/ +120° Polybutadiene base. Adapt for cables when waterproof sealing is required. Low temperature resistance.
Sepur 114 FR +
DK 001		 100÷14 2000 <10 -40°/ +120° Self-extinguishing + no settlements. Medium soft and elastic. High thermal conductivity. Fit for a wide range of application.

Discover all the equipment for potting and encapsulation

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Industries

 
  • Conectores
  • Cables
  • Control del sistema eléctrico
  • Balastos
  • Relé
  • Motores de electrodomésticos
  • Condensadores
  • Elementos de calefacción protegidos
  • Condensadores del factor de potencia
  • Sensores
  • Transductores
  • Termosensores
  • Filtros de reducción de ruidos
  • Transformadores
  • Transformadores toroidales
  • Motores no-frost
  • Inductores
  • Placa de circuito impreso (PCB)
  • Transformadores eléctricos
  • Solenoides

FomexOne: no limits included

The innovative line to seal hermetically all those components that are constantly exposed to atmospheric agents, humidity, water, dust, grime and all chemical agents with lower breaking risk.

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All the challenges, trends, opportunities you should know

The importance of component’s insulation in the automotive sector. new and old challenges, trends and opportunities.

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