Sealing & Bonding

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DEMAK offers a complete solution for adhesives and sealants suitable to be used across a wide range of substrate types.
Typical applications for which we have the right technical solution are automotive, house-appliance, marine, electronics, composites, renewable energy, medical and health care, telecommunications.
Thanks also to the most advanced available materials in terms of Adhesion, Bond Strength and Thermal Resistance, we can support you to find the most suitable material for your application offering you assistance from the design stage through the manufacturing process.



Sealing is the process of filling a complete mechanic or electronic assembly with thermo-setting two component epoxies, polyurethanes, polybu-tadienes, silicones modified resins. Usually the potting compound is poured into a plastic box or metal case, where the electronic unit is placed.

Bonding involves building a mold or frame around an object, e.g., wires, filling the space between the frame and the object with a thermosetting polyurethane, epoxy or silicone. The mold is usually removed after resin polymerization.

40 years

of innovation in resins
application techniques