- wide range of hardness from shoreD 20 to shoreD 85;
- wide range of Glass Transition;
- wide range of viscosity;
- high wetting and penetration between wires and cables;
- high humidity and water resistance.
S.E. SPECIAL ENGINES develops and produces high-performance PU and Epoxy resin for the electrical and electronic industry.
These systems are designed for high and low voltage applications.
S.E. (SPECIAL ENGINES) develops and produces high-performance Epoxy resins for the high-voltage applications, where the maximum impregnation of the windings is necessary.
We can support you with our knowledge to select the best process in order to enhance the dielectric properties of the units.
|RESIN + HARDENER||Mix Ratio (by weight)||Mixed Viscosity @ 25°C||Glass Transition Tg °C||Thermal Conductivity [W/m°k]||Description|
|Sepox 216+DK 601||100:30||800||13||0.4||Ideal for small devices (above all relays). Its low viscosity allows easy filling of narrow parts. High thermal shock resistant.|
|Sepox 225+DK505||100:50||700||40||0.2||Transparent. Low viscosity.|
|UL Sepox 213 FR+DK503||100:13||70||65||0.9||Flame resistant: UL 94 V0 4mm FILE E358582. Low viscosity with a special combination of fillers that assures no sedimentation even at high T°. Recommended for non-stop productions.|
|Sepox 215 FR+DK507||100:13||2000||100||0.9||Flame resistant. High mechanical properties and low shrinkage in polymerization. Excellent anti-settling properties. No abrasion.|
|Sepox 206+DK602||100:50 (100:100)||80000 (60000)||nc||0.33-0.66||Adjustable final hardness according to mixing ratio. In compliance with MIL T 27-C (for Transormers and Inductors). High mechanical properties.|
|Sepox 214 FR+DK506||100:8||2000||70||0.6||Flame Retardant, mineral filled version of the Sepox 214.|
|Sepox 213 FR LV+DK503||100:13||1000||80||0.8||Flame resistant: UL 94 V0 4mm FILE E358582. Similar to Sepox 213 FR but suggested when lower hardness is needed.|
|Sepox 230+DK503 L||100:15||10000||63||0.8||Excellent mechanical properties. Low shrinkage and low exothermicity in polymerization.|
|RESIN + HARDENER||Mix Ratio (by weight)||Mixed Viscosity @ 70°C||Glass Transition Tg °C||Operating Temperature [°C]||Description|
|Sepox 233 FR+DK441||100:35||500||-15||-55°/ +180°||High elasticity, excellent thermal shock resistance. Thermal class H|
|Sepox 235+DK401||100:35||150||85||-55°/ +180°||High Thermal Conductivity, very high dielectric properties, good wetting on wires. Suggested for Vacuum Dispensing. Thermal class H|
|Sepox 234 FR TG+DK434||100:100||800||100||-55°/ +180°||Flame Resistant: UL 94 V0 Thermal Class H. High thermal conductivity. Very low shrinkage.|
|Sepox 237+DK401||100:32||200||115||-55°/ +180°||High Thermal Conductivity, very high dielectric properties, good wetting on wires. Suggested for Vacuum Dispensing. Thermal class H|
|Sepox 241 FR+DK 401F||100:35||150||102||-55°/ +180°||Flame Resistant: UL 94 V0 Thermal Class H. High thermal conductivity.|
|Sepox 239+DK403||100:36||150||140||-55°/ +180°||High Tg. Special product for pencil coils.|
|RESIN + HARDENER||Mix Ratio (by weight)||Mixed Viscosity @ 25°C||Glass Transition Tg °C||Operating Temperature [°C]||Description|
|Sepur 116 FR+DK001||100:16||1400||-15||-40°/ +130°||PU filled suitable when Self-extinguishing properties are required. Soft and elastic (Tg<15°C). Adapt for a wide range of applications. Very good thermal conductivity.|
|Sepur BD 020 FR+DK001||100:13||4000||<-40||-50°/ +130°||Polybutadiene based Pu filled for application requiring Flame self-extinguishing and high thermal conductivity features. Low temperature resistance. High Waterproof resistance (wet environments or immersion applications). Special for High Power Inverter - Power and Control Electronics.|
|Sepur 125 FR+DK001||100:25||2500||50||-40°/ +130°||General use System. Good mechanical resistance, low shrinkage in polymerization. Flame self-extinguishing. Special for: Capacitors featuring metalized plastic film.|
|Sepur 121 FR+DK001||100:40||750||105||-40°/ +155°||Usually fo transformers and capacitors requiring Flame self-extinguishing feature at low thickness. Low viscosity. Low shrinkage in curing. High Tg.|
|Sepur 119 FR+DK001||100:18||1400||<-50||-50°/ +130°||Special product for sensors. Filled PU with very low Glass Transition, adapt for low temperature applications. No change in mechanical properties during thermal ageing (@130°)|
|Sepur 116+DK001||100:20||1800||3||-40°/ +130°||Cost effective competitive PU filled. Good thermal conductivity. Low viscosity. General purpose.|
|Sepur BD 001+DK015||100:34||1500||<-50||-50°/ +120°||Polybutadiene base. Adapt for cables when waterproof sealing is required. Low temperature resistance.|
|Sepur 114 FR+DK001||100:14||2000||<10||-40°/ +120°||Self-extinguishing + no settlements. Medium soft and elastic. High thermal conductivity. Fit for a wide range of application.|
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